- PCB Fabrication
- Flip Chip Technologies
- Pcb Turnkey Assembly Services
- AOI
- Design Validation Test (DVT)
- Electronics Manufacturing
- Communications Software
- Sustaining Engineering Service
- Prototyping And New Product In
- Pcb Turnkey Assembly Services
- 0201 Technology
- Compliance And Regulatory Engi
- Mechanicals
- ICT
- Applications Software Developm
- Applications Software Developm
- Communications Software
- Prototyping And Product Introd
- Sustaining Engineering Service
- Design Center Quality Certific
- Process Validation Phase
- Concept Study
- Electrical Engineering
Topscom technology.Co.,LtD
20 Years Of Electronics Products Turnkey OEM/ODM,Website:http://www.china-pcbaoe
Topscom technology.Co.,LtD
Date: 24th August 2016
Flip Chip Technologies
Flip chip is a critical technology for miniaturization, and Topscom enjoys technical expertise in board assembly using several different forms, including:Solder Bumped Flip Chip TechnologyAnisotropic Conductive Adhesive Flip Chip TechnologyUltrasonic Bonding Flip Chip TechnologyIn addition, Topscom performs detailed analyses of equipment capability, materials requirements, process parameters, reliability, and process control.
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Phone:
86-755-22211988
Fax:
86-755-22211988
Address:
No 18, Tannan Road,Tanjia Industrial Village,Gongming Street,Guangming New District,Shenzhen City,China.
shenzhen, 518000
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